A heat-shrinkable multilayer material for packaging, in particular food packaging, comprises a first layer made of heat-shrinkable material, a microwave susceptible material covering at least a part of the first layer, at least one second layer made of shrinkable or non-shrinkable material, the first and second layer can be connected to each other by embedding the microwave susceptible material, wherein the microwave susceptible material is arranged in a pattern between the first and second layer, the pattern creating areas of increased stiffness within the multilayer material when microwave energy is applied onto.