An LED chip package body includes an LED chip having a pad-installed surface, a plurality of pads installed on the pad-installed surface and a rear surface formed on an opposite side of the pad-installed surface. A light-reflecting coating is disposed on the pad-installed surface and has a plurality of exposed holes for exposure of the corresponding pads. A first insulative layer is formed on the light-reflecting coating and has a plurality of through holes communicating with the corresponding exposed holes. A second insulative layer is disposed on the rear surface and has a central through hole for exposure of a central portion of the rear surface. A lens is received in the central through hole. Each of a plurality of external connected conductive bodies is electrically connected to the corresponding pad and projects out of the corresponding through hole in the first insulative layer.