A semiconductor device includes a mount substrate and a semiconductor chip mounted upon the mount substrate via a metal bump, wherein metal bump includes an inner part joined to the semiconductor chip and an outer part covering the inner part, the outer part having an increased hardness as compared with the inner part.

 
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< Semiconductor device having an electronic circuit disposed therein

> Organic electroluminescence device having a cathode with a metal layer that includes a first metal and a low work function metal
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