A method for directly forming a cutter mold with double etching and an apparatus thereof includes the following steps: a metal plate for being made, the cutter mold is tightly pressed with a light-resisting agent membrane first, an image of cutter mold drawing, which provides lines with widths thereof being one fifth or one tenth of the lines on the ink drawing of conventional cutter mold, is transferred to the light-resisting agent membrane. The thinner lines perform obstructing the etching liquid, which sprays toward the membrane to etch the work. Finally, the unnecessary membrane is peeled and two lateral sides of the formed cutter mold are etched with light etching liquid to complete the cutter mold with a sharp blade.