The present invention provides a polypropylene resin composition having good moldability and giving a film or a sheet that is excellent in transparency and heat-sealing properties. A polypropylene resin composition of the present invention comprises 1 to 50 wt % of a propylene polymer (A) whose melting point Tm as measured with a differential scanning calorimeter (DSC) is 150.degree. C. or higher, 10 to 90 wt % of a propylene copolymer (B) whose melting point Tm is 100.degree. C. or higher and below 150.degree. C., and 1 to 80 wt % of an olefin copolymer (C) whose melting point is 40.degree. C. or higher and below 100.degree. C., comprising 50 mol % or more of a constitutional unit derived from either one of propylene or 1-butene (a) and 50 mol % or less of a constitutional unit derived from an .alpha.-olefin having 2 to 20 carbon atoms (b) other than the constitutional unit (a) (here, the sum of (a) and (b) is 100 mol %). A film obtained from this resin composition is suitable as a packaging film for food and the like.