A circuit arrangement comprises at least one power component and a drive circuit for the power component, which are integrated in a first and a second semiconductor chip. Only CMOS components of the drive circuit or CMOS components, capacitive components and resistance components of the drive circuit are integrated in the first semiconductor chip, and the at least one power component and further components of the drive circuit are integrated in the second semiconductor chip.

 
Web www.patentalert.com

< Semiconductor device and method of fabrication

> Wire bonded wafer level cavity package

~ 00474