A microelectromechanical device package with integral a heater and a
method for packaging the microelectromechanical device are disclosed in
this invention. The microelectromechanical device package comprises a
first package substrate and second substrate, between which a
microelectromechanical device, such as a micromirror array device is
located. In order to bonding the first and second package substrates so
as to package the microelectromechanical device inside, a sealing medium
layer is deposited, and heated by the heater so as to bond the first and
second package substrates together.