A system and a method are disclosed for providing a temperature compensated under-voltage-lockout circuit that has a trip point voltage that is not sensitive to temperature variation. The under-voltage-lockout circuit of the invention comprises (1) an inverter circuit that is coupled to a supply voltage and (2) a temperature compensation circuit that is coupled to the supply voltage and to the inverter circuit. The temperature compensation circuit and the inverter circuit temperature compensate a trip point voltage of the inverter circuit by driving an input of the inverter circuit with a voltage that has a same temperature coefficient as the trip point voltage of the inverter circuit.