A device for testing heat conduction performance of a heat pipe is provided. In which the heat pipe to be tested includes an evaporating section and a condensing section. The device includes a block, a cooling device, a thermal interface material, a heating element for heating the block and a plurality of thermal probes. The block is coupled with the evaporating section of the heat pipe. The cooling device is coupled with the condensing section of the heat pipe. The thermal interface material is configured to be at a coupling interface between the block and the evaporating section of the heat pipe. The thermal probes are inserted into the block and the cooling device to measure the respective temperatures of distinct regions in the block and the cooling device where the thermal probes are located.