It is an object of the present invention to provide a method for manufacturing a semiconductor device in which a desired region can be etched by evenly applying a solution including a resist and a method for manufacturing a semiconductor device having a laminated structure by forming an interlayer insulating layer with an organic resin.

 
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< Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

> Barrier layer for conductive features
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