A semiconductor device integrated with opto-electric component and method for fabricating the same provides a wafer with a plurality of optical transmitter/receiver components, and each of the optical transmitter/receiver components having an active surface and an opposite non-active surface, wherein a plurality of connecting pads and an optical active area are formed on the active surface; a dielectric layer and a circuit layer formed on the active surface, wherein the circuit layer is electrically connected to the connecting pads through electrical conductive vias formed in the dielectric layer; and an opening formed through the dielectric layer to expose the optical active area on the active surface; then an insulating layer is further formed on the circuit layer. By performing a routing process on the wafer to form a plurality of integrated devices with the optical transmitter/receiver components and circuit structures to fulfill the small and lightweight requirements of the electronic device.