A computer-implemented method, system and computer program device are provided for monitoring production of semiconductor products to detect potential defect excursions. Equipment based data is collected reflecting equipment performance for a plurality of semiconductor manufacturing tools used for processing a plurality of semiconductor products. Also, product level data is collected reflecting product quality for the plurality of semiconductor products processed on the plurality of manufacturing tools. At least a portion of the product level data and at least a portion of the equipment based data are then correlated. At least one report is generated of the correlation of data.