A semiconductor structure includes a semiconductor substrate, a recess
located in at least one major surface of the substrate, an electrical
insulating layer located over the at least one major surface and in the
recess, a conductive barrier located over the insulating layer and in the
recess and over the at least one major surface, a plating seed layer
located over the conductive barrier within the recess only, and a
conductive metal in the recess only.