An electronic element (a semiconductor chip) is joining on a wiring board with the active surface thereof facing up (die-bonding step). A slope linked from the surface of the wiring board to the active surface of the electronic element is formed at the periphery of the electronic element (slope forming step). Metallic wiring for connecting electrode terminals on the active surface to wiring patterns on the wiring board is formed on the surface of the slope by a droplet ejection method (metallic wiring forming step). In the invention, prior to forming the metallic wiring, an organic insulating membrane formed of epoxy resin or urethane resin is formed on the active surface of the electronic element, on which the corresponding metallic wiring is formed (insulative ink processing step), thereby improving adhesivity.