Embodiments of a current sensing circuit for a multi-phase DC-DC converter are disclosed. In one embodiment, an integrated circuit (IC) may be provided that has high- and low-side switch arrays being coupled to an output terminal as well as being coupled between high and low voltage terminals. The switch arrays may also include at least one bonding pad and at least one bonding wire. The IC may also include a driver coupled to the switch arrays for driving the switch arrays and a sensing circuit that coupled to the bonding pad for detecting a signal passing through the bonding wire.