A driver package includes an integrated circuit (IC) comprising pull up
circuitry capable of turning ON an associated switch and pull down
circuitry capable of turning OFF the associated switch. The pull up
circuitry may be coupled to a first bonding pad of the IC, and the pull
down circuitry may be coupled to a second bonding pad of the IC. The
driver package may further comprise a first conductive path coupled
between the first bonding pad and a package pin of the driver package,
where the package pin is coupled to the associated switch, and a second
conductive path coupled between the second bonding pad and the package
pin. The first conductive path may further provide a sensed signal
representative of state of the associated switch to break before make
control circuitry to assist in minimizing a break before make delay time
interval.