A flip chip mounted semiconductor device package having a dimpled leadframe is disclosed. The semiconductor device package includes a leadframe having a plurality of source dimples and a gate dimple, and a semiconductor die having a plurality of source contact areas and a gate contact area corresponding to the leadframe source dimples and gate dimple respectively, the semiconductor die being flipped onto the leadframe such that cured conductive epoxy provides electrical and mechanical contact between the plurality of source contact areas and the plurality of source dimples, and the gate contact area and the gate dimple.