There is described a method for producing a packaged integrated circuit.
The method comprises a first step of building an integrated circuit
having a micro-structure suspended above a micro-cavity, and having a
heating element on the micro-structure capable of heating itself and its
immediate surroundings. A layer of protective material is then deposited
on said micro-structure such that at least a top surface of the
micro-structure and an opening of the micro-cavity is covered, wherein
the protective material is in a solid state at room temperature and can
protect the micro-structure during silicon wafer dicing procedures and
subsequent packaging. The integrated circuit is packaged and an electric
current is passed through the heating element such that a portion of the
protective material is removed and an unobstructed volume is provided
above and below the micro-structure.