A mold for in-mold decorating that includes a stationary mold member and a movable mold member through which a decorating film can be passed. At least one of the mold members includes a cavity-forming block with molding cavity configured to receive a design pattern of the decorating film, a dieset, and engaging portions for mounting the cavity-forming block on the dieset. Clamping-force receiving portions are located around the cavity-forming block such that a clamping force is not applied to the decorating film when the mold members are joined.