The present invention discloses a LED (Light-Emitting Diode) heat-dissipating module, which comprises a heat-dissipating fin, a heat-conduction pipe, a LED illumination module and a casing. The heat-dissipating fin has an insertion/press-fit member inserted by or press-fitted to the heat-conduction pipe. The heat-conduction pipe has a contact region contacting the LED illumination module. In the application of the present invention, the LED illumination module is installed on the contact regions of several heat-conduction pipes inserted into or press-fitted to the heat-dissipating fins; thus, the heat generated by the LED illumination module can be effectively dissipated. Then, the LED illumination module is placed inside the casing having an accommodation space. Thus, heat can be conducted via the heat-conduction pipe to the heat-dissipating fin and then fast dissipated therefrom even though the LED illumination module is placed inside the casing.