The invention includes a die-level opto-electronic device with a semiconductor die and a photonic device including a conductive structure formed in the die away from the edges of the die. The conductive structure is electrically connected to the photonic device. The device also includes an optically transparent laminate attached to overlay the photonic device. The invention also comprises a semiconductor wafer with a plurality of photonic devices exposed on a first surface and a plurality of conductive structures being exposed on a second surface opposing the first surface. The conductive structures are electrically connected to the photonic devices which are overlaid with an optically transparent laminate. The invention further includes methods of forming die-level opto-electronic devices and semiconductor wafers.