An embodiment of the present invention provides an apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a top tier substrate and a second portion of the integrated circuit is placed on a bottom tier substrate stacked adjacent the top tier substrate and wherein the first portion and the second portion of the integrated circuit are interconnected; and printed spiral arms stacked vertically on both the top and bottom surface of the top tier substrate thereby creating high Q inductors.

 
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