A micro-systems technology (MST) device for attachment to an adhesive surface. The MST device has an attachment surface for abutting the adhesive surfaces, a first fluid conduit connected to a first aperture in the attachment surface and, a recess in the attachment surface adjacent the first aperture to hold adhesive displaced from between the attachment surface and the adhesive surface when the MST device is attached such that displaced adhesive does not block fluid flow in the first conduit. By profiling the attachment surface so there is a recess next to the first aperture, there is less risk that adhesive will be squeezed into the conduit and impair fluid flow.