An exposure apparatus configured to expose a substrate to radiant energy via an original plate while scanning of the original plate and the substrate are performed including a projection optical system configured to project light from the original plate onto the substrate, an original plate configured to hold the original plate and to be moved a substrate stage configured to hold the substrate and to be moved a measurement device configured to measure a position of a surface of a substrate facing the projection optical system in a direction of an optical axis of the projection optical system a processor configured to control a movement of the original plate stage, a movement of the substrate stage, and an operation of the measurement device, and an input device configured to input information about a measurement portion in the surface to be measured by the measurement device. The processor is configured to cause the measurement device to perform measurement of a position of the surface with respect to a measurement portion determined by the information, to cause the scanning to start after the measurement, and to cause the substrate stage to move in the direction of the optical axis during the scanning based on the position of the surface obtained by the measurement.