A method and apparatus is provided for attaching a cooling structure to the surface of an integrated circuit (IC). The attachment of the cooling structure, for example a heat sink, to the IC requires that certain pressure is applied, usually by connecting the cooling structure to a Printed Circuit Board (PCB). However, excess pressure may damage the ball grid array (BGA) that connects the IC to the PCB. Attachment of a cooling structure to the IC package substrate is provided without support from the PCB. In one embodiment, shock absorbers are also attached to the cooling structure and the PCB to prevent undesirable vibration of the heat sink mass from affecting the IC.