Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps (40) formed in a glass substrate (12 or 100). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.

 
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