An optical semiconductor module includes an optical semiconductor element;
an optical fiber optically coupled with the semiconductor element; a base
having an upper surface and a lower surface; and a package. The package
has a bottom plate on which the base is mounted, a front wall having a
hole through which the optical fiber is inserted, and a rear wall
opposite to the front wall. The optical fiber and the optical
semiconductor element are mounted on the upper surface. The base has a
rear face formed on an end portion opposite to the front wall, and the
rear face is positioned above the lower surface of the base.