An adhesive film in roll for wafer processing is constituted by laminated multiple layers including a base film, a radiation curing type adhesive layer, and a releasing film in this sequence, in which the arithmetic average roughness (Ra) of the side of the base film and/or releasing film opposite to the radiation curing type adhesive layer is 1 .mu.m or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.