An electronic device package is described that includes a non-metal die
attached adhesive. The die attach is positioned in discrete positions on
a surface to which the die will be fixed. The die is placed on the
discrete die attach. The die attach, in an embodiment, is an epoxy resin
or other material that is cured. After curing, the die is electrically
connected to an external circuit. The volume between the die and surface
is filled with an underfill. In an embodiment, underfill cross-links with
the die attach.