A method of forming a pattern includes forming a resist layer on a substrate, cleaning a surface of the substrate under a control that a shear stress acting on an interface between a cleaning liquid and the substrate during the cleaning becomes larger than a shear stress acting on an interface between an immersion liquid and the substrate during immersion exposure, exposing the resist layer by the immersion exposure to form a latent image on the resist layer, and developing the resist layer to form a resist pattern on the substrate.