A temporary chip attach carrier for and a method of testing an integrated circuit chip. The carrier includes: a substrate, a first array of interconnects disposed on a bottom surface and a second array of interconnects disposed on a top surface of the substrate, corresponding interconnects of the first and second arrays of interconnects electrically connected by wires in the substrate; an interposer, a first array of pads disposed on a top surface of the interposer and a second array of pads disposed on a bottom surface of the interposer, corresponding pads of the first and second arrays of pads electrically connected by wires in the interposer, and pads of the second array in direct physical and electrical contact with corresponding interconnects of the second set of interconnects; and wherein the interposer includes an interposer substrate of the same material as a substrate of the integrated circuit chip.