A switch contains a first semiconductor die, which is configured to receive signals on a plurality of input ports and to output the signals on a plurality of output ports. The first semiconductor die is further configured to selectively couple the signals between the input and output ports using a plurality of switching elements in accordance with a set of control signals, which correspond to a configuration of the switch. During this process, a plurality of proximity connectors, proximate to a surface of the semiconductor die, are configured to communicate the signals by capacitive coupling.