A dicing die adhesive film for semiconductor of the present invention has
a 3-layered structure including a first adhesive layer attached on the
back of a semiconductor wafer; a second adhesive layer attached onto the
first adhesive layer; and a dicing film attached onto the second adhesive
layer, and therefore has an advantage that it can ensure reliability of
the semiconductor packaging process since it may prevent the die-flying
phenomenon and the poor pickup of the die in the dicing process and
maintain a sufficient adhesive force between the die and the substrate
upon die boding.