A focused laser beam having an optical axis passes through a first lens mounted to a first galvanometer and a second lens mounted to a second galvanometer. The first galvanometer is adapted to tilt the first lens about a X axis and the second galvanometer is adapted to tilt the second lens about a Y axis. This displaces the focused laser beam in a controlled manner from the optical axis to enable laser machining of very precise geometric features over a large processing window. In a preferred embodiment, the first and second lenses are a pair of inverted positive meniscus lenses, of high index of refraction material.

 
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> Semiconductor laser apparatus

~ 00497