A heat dissipation module and an electronic device assembly having the heat dissipation module are provided. The electronic device includes an enclosure, a plurality of heat generating components received in the enclosure, an electronic device received in the enclosure, and a heat dissipation module received in the enclosure. The electronic device has a motor. The heat dissipation module includes a casing defining an airflow passage therethrough, and a rotation member being disposed at the airflow passage and having a plurality of blades. The airflow passage communicates with outside of the enclosure. The motor is capable of driving the rotation member to rotate to thereby expel heat inside of the enclosure to outside of the enclosure via airflow generated by the blades.