A package structure and a lead frame using the same are provided. The package structure includes a lead frame, a chip and an adhesive. The lead frame has a first surface and a second surface opposite to the first surface. The first surface has a chip adherent area. The lead frame includes a plurality of through holes and grooves. The through holes penetrate through the first surface and the second surface to be disposed around the chip adherent area. The grooves are disposed on the first surface. The grooves connect the neighboring through holes to form an annular trace disposed around the chip adherent area. The chip is disposed on the chip adherent area. The adhesive is disposed between the chip and the lead frame, and is diffused in the annular trace.