Disclosed is a two-component adhesive used for electrically and
mechanically interconnecting two objects for bonding. The two-component
adhesive is made up by first and second adhesive materials separately
containing first and second curing agents, respectively. It is only after
reaction of the first and second curing agents that the first and second
resin components are polymerized. As long as the two adhesive materials
are isolated from each other, the adhesive is not cured. In case a metal
chelate or a metal alcoholate is used as the first curing agent and a
silane coupling agent is used as the second curing agent, cations as a
curing component are isolated to cause cationinc polymerization of the
first and second resin components to allow for curing at a lower
temperature in a shorter time than in case a conventional adhesive is
used.