An electronic assembly is constructed with an enclosed fluid-cooled cold plate. Pressurized cooling fluid is propelled through the cold plate to carry away heat from the electronic assembly. The cold plate is constructed from a plurality of enclosure elements which are attached together with a thermally-conductive adhesive. The adhesive may be cured at a low temperature of about 125.degree. C. The cold plate may be produced from thin metal without distortion or warping that might otherwise result from assembly at higher temperatures.