A printed circuit board (18) for electrically connecting to an optical subassembly (16) includes a board base (230), a conductive trace (232), and a board conductor (234). The optical subassembly (16) includes at least one component pad (346). The board base (230) is made of a substantially nonconductive material. Further, the board base (230) defines a recessed region (238) that is sized and shaped to receive a portion of the optical subassembly (16). The conductive trace (232) is secured to the board base (230). The board conductor (234) is positioned near the receiver region (238). Further, the board conductor (234) is positioned near the component pad (346) when the optical subassembly (16) is positioned in the receiver region (238). Moreover, the board conductor (234) is electrically connected to the conductive trace (232).