A process for fabricating an optically coupled resonant pressure sensor includes the steps of forming a sensor die including at least one optically coupled resonator from a first semiconductor substrate and forming a cap die including a fiber hole from a second semiconductor substrate. The sensor die and the cap die are aligned and bonded to form a resonant pressure sensor capsule. The fiber hole in the cap die is aligned with at least one resonator on the sensor die. Also disclosed is an optically coupled resonant pressure sensor formed from steps thereof.