An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold adhesion surface, and a die attachment surface wherein the soldering surface and bonding surface are selectively plated with nickel/palladium/gold. The mold adhesion surface and the die attachment surface are roughened for better attachment to a mold and a die respectively.