A wireless earpiece assembly configured to physically contact a user exclusively at an ear support behind a user's ear when in use. The ear support does not exceed about 0.25 inches in width. The assembly is configured to distribute a significant portion of its bulk away from the isolated location of a user's ear for long term user comfort without sacrifice of audio or communicational integrity. The wireless earpiece assembly simultaneously eliminates the use of any conventional extraneous wiring in order to optimize the un-encumbering user-friendly advantages afforded by wireless technology.