A method for making packets of nanostructures is presented. The method includes etching trenches in a silicon substrate. Nanostructures are grown in the trenches. The trenches are then filled with a filler material. Any filler and/or nanostructures material extending beyond the trench is removed. The silicon substrate is etched away, resulting in a nanopellet surrounding the nanostructures and wherein each nanostructures has a generally uniform length and direction. Nanostructures can comprise nanotubes, nanowires and nanofibers. The method eases the manipulation of nanostructures while providing geometrical uniformity.