A press-bonding anisotropic conductive resin composition comprising (A) an
organopolysiloxane having on the average at least two alkenyl groups per
molecule, (B) an adhesion promoter, (C) finely divided silica, (D)
metallized conductive particles, and (E) a curing agent becomes an
anisotropic conductor by press bonding. The conductive particles
accommodate height variations among electrode terminals, allowing the
composition to achieve stable interconnects between all electrode
terminals.