It is an object of the present invention to provide a conductive fine particle having excellent conductivity, furthermore high adhesiveness with a core particle and little cohesion, a method for producing the conductive fine particle where the plating bath is highly stable and an anisotropic conductive material using the conductive fine particle.The present invention is a conductive fine particle, wherein an alloy plated coating film containing nickel, copper and phosphorous is formed on a surface of a core particle by an electroless plating method; preferably the conductive fine particle, wherein a content of phosphorous in the alloy plated coating film in a direction of a thickness is lower on a surface side of the alloy plated coating film than on a core particle side; a method for producing the conductive fine particle, wherein a first electroless plating reaction is carried out by adding a plating solution containing a nickel salt, a phosphorous reducing agent and a pH adjustor to an aqueous suspension of the core particles supporting a metal catalyst, and then, a second electroless plating reaction is carried out by adding a plating solution containing the nickel salt, a copper salt, the phosphorous based reducing agent and the pH adjustor.