Disclosed is a curable composition having a low CTE. In one embodiment, a curable composition is disclosed that comprises (i) a binder comprising at least one epoxy compound of the structure: X--((CH.sub.2).sub.m--(N)--((CH.sub.2).sub.n-(Z)).sub.2).sub.p wherein X is an aromatic ring or a six membered cycloaliphatic ring, m is from about 0 to about 2, n is from about 1 to about 3, Z is an epoxy group of empirical formula: C.sub.2H.sub.3O, p is a number from about 2 to about 3, and (ii) a cross-linking agent comprising at least one polyamine. This curable composition is characterized by a CTE of no more than 60 ppm/.degree. C. when cured for a time of from about 20 to about 60 minutes at temperature of from about 100 to 240.degree. C. Also disclosed are methods of making integrated circuits and integrated circuits made there from, especially flip chips.