A defect inspecting apparatus comprising: an inspection region dividing
section which divides a defect inspection region of a wafer on which a
circuit pattern is formed into a plurality of inspection subregions; a
pattern density calculating section which calculates the pattern density
of each of the inspection subregions on the basis of design data of the
circuit pattern; an inspection execution region and sensitivity rank
setting section which assigns a sensitivity rank based on the pattern
density to a plurality of inspection execution regions, each including a
plurality of the inspection subregions; and a defect inspecting section
which sets an inspection parameter on the basis of sensitivity ranks of
the inspection execution regions and inspects the inspection execution
regions for a defect.