Polyimide substrates, and polymer laminates for optical and electronic
applications are described. Single or multi-layer waveguide structures
are deposited on the polyimide substrates. Laminates including polymer or
a hybrid organic/inorganic waveguiding film can be deposited on a
polished polyimide substrate. The laminate can also include piezoelectric
and metallic layers. Micromachined optical devices, such as cantilevered
waveguide are fabricated by laser ablation using a combination of IR and
UV lasers. A fiber-to-waveguide coupler with a laser-machined groove for
holding the fiber is also disclosed. Holes are drilled with excimer and
YAG laser in the polyimide substrate and metallized to provide continuous
electrical contact between both sides of the substrate. Metallized
polyimide substrates are bumped and stacked to provide high density
interconnects. The polyimide substrate is bonded to a semiconductor
wafer. Thin SOI or epitaxially grown layer with devices is transferred to
the polyimide substrate by grinding and etching the semiconductor wafer.