A semiconductor chip electrical connection structure includes electrode pads formed on a surface of a semiconductor chip, wherein the semiconductor chip is mounted via another surface thereof on a carrier; a plurality of conductive bumps formed on the electrode pads respectively, and exposed from a dielectric layer applied on the semiconductor chip and the carrier; and a plurality of electrical connection pads formed on the dielectric layer and electrically connected to the conductive bumps exposed from the dielectric layer so as to provide outward electrical extension for the semiconductor chip via the electrical connection pads.