Provided is an apparatus for cooling heat generating computer parts that installed in a computer. The apparatus includes a heat transferring block capable of being thermally coupled to the heat generating parts to conduct the heat generated by the heat dissipating parts; at least one heat pipe, each including a block coupling portion thermally coupled to the heat transferring block and a fin coupling portion formed of a generally curved shape composed essentially of one or more circular arc portions; and a plurality of heat dissipating fins, each having at least one perforation hole. The geometry of the curvature of the entirety of the fin coupling portion is shaped so that the geometry alone would not allow the heat pipe to be inserted through the perforation hole of the heat dissipating fins. The fin coupling portion of the heat pipe passes through each of the at least one perforation hole of the plurality of heat dissipating fins. Each of the heat dissipating fins are spaced apart from one another along the fin coupling portion and positioned to the fin coupling portion.